产品分类
真空退火设备
所属分类：
第一代半导体工艺设备
概要：
◆ 主要用于半导体器件退火及烧结等工艺，可进行真空、气体?；さ? ◆ 设备结构新颖,操作方便 ◆ 在一台设备上可以完成多个工艺流程
关键词：
真空退火
真空退火设备
产品概述/Product Introduction：
♦ 主要用于半导体器件退火及烧结等工艺，可进行真空、气体?；さ?/p>
Mainly used for annealing and sintering of semiconductor devices, and can be protected by vacuum and gas
♦ 设备结构新颖，操作方便
The equipment has novel structure and convenient operation
♦ 在一台设备上可以完成多个工艺流程
Multiple process flows can be completed on one equipment
产品特点/Product Characteristics：
♦ 自动化程度高
High degree of automation
♦ 采用进口温度控制器，温控器能受控运行、停止、保持，灵活控制工艺温度变化
Adopting imported temperature controller, the temperature controllercan be controlled to run, stop andmaintain, and flexibly control the process temperature change
♦ 电气元器件采用进口知名品牌元器件，保证了设备具有较好的稳定性、可靠性
The electrical components are imported well-known brand components, which ensures good stability andreliability of the equipment
♦ 处理全过程由工业计算机智能化自动控制化能够实现全程监控、跟踪、自诊断功能、模拟显示设备的工作状态，升温和降温速度可控
The whole processing process is controlled by industrial computer intelligently and automatically, which canrealize the functions of whole process monitoring,tracking and self-diagnosis, simulate and display the workingstate of equipment, and control the heating and cooling speed
技术指标/Technical Indicators：
|
最高温度:200-800℃ Maximum temperature: 200-800℃ |
恒温区:1200mm(长度可定制) Constant temperature zone: 1200mm (length can be customized) |
|
控温精度:±1℃ Temperature control accuracy: ± 1℃ |
真空室:2-3工位 Vacuum chamber: 2-3 stations |
|
真空度:≤5*10-4*pa Vacuum degree:≤5*10-4*pa |
升温速率:15℃/min Heating rate: 15℃/min |
|
气氛?；?快速开启式安全阀等 Atmosphere protection: quick opening safetyvalve, etc. |
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